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Silicon on Insulator (SOI) Wafers

Silicon on Insulator (SOI) Wafers

Typical Specification:

 

Diameter: 3-Inch (76.2mm), 100mm, 125mm, 150mm, 200mm

Device-Layer: 380nm - 100μm

Box-Layer: 100nm - 10μm

Handle-Layer: 300μm - 775μm

Bonding Methods: Direct-Bonding, Epi-Layer-Transfer, Oxygen Implantation

 

Other Materials

SOG, GOS

 

 

 

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