Silicon on Insulator (SOI) Wafers

Typical Specification:

Diameter: 3-Inch (76.2mm), 100mm, 125mm, 150mm, 200mm

Device-Layer: 380nm – 100μm

Box-Layer: 100nm – 10μm

Handle-Layer: 300μm – 775μm

Bonding Methods: Direct-Bonding, Epi-Layer-Transfer, Oxygen Implantation

Other Materials

SOG, GOS